? 2005 california micro devices corp. all rights reserved. 12/13/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 cm1418 preliminary praetorian ? l-c emi filter with esd protection for headset speaker applications features ? 2 channels of emi filtering ? 30kv esd protection ? (iec 61000-4-2, contact discharge) ? 30kv esd protection (hbm) ? optiguard ? coating for improved reliability at assembly ? greater than 35db of attenuation at 1ghz ? 6-bump, 1.720mm x 1.220mm footprint chip scale package (csp) ? lead-free version available applications ? headset speaker port in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? emi filtering for data port s in cell phones, pdas or notebook computers. product description california micro devices? cm 1418 is an l-c emi filter array with esd protection, which integrates two pi- filters (c-l-c) for the headset speaker. the cm1418 has component values of 117pf-3.0nh-117pf. the parts include esd protection diodes on all input/output pins, which provide a very high level of protection for sensitive electronic compone nts that may be subjected to electrostatic discharge (esd). the esd diodes connected to the filter ports safely dissipate esd strikes of 30kv, beyond the maximum requirement of the iec61000-4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30kv. this device is particular ly well suited for portable electronics (e.g. mobile handsets, pdas, notebook computers) because of its small package format and easy-to-use pin assignments. in particular, the cm1418 is ideal for emi filtering and protecting speaker output lines from esd for the headset speaker in mobile handsets. most speakers have impedance of 8 and in order to maximize the power output, the resistance of an emi filter needs to be as low as possible and the cm1418 addresses this by having a c-l-c based emi filter where the inductor has less than 0.35 of resistance. the cm1418 is available either uncoated or with opti- guard ? coating resulting in improved reliability at assembly. the cm1418 is also available in a space saving, low profile chip scale package with optional lead-free finishing . electrical schematic 3nh 117pf 117pf 3nh a3 b3 a1 b1 filter #1 filter #2 filter #2 filter #1 117pf 117pf a2 gnd b2 gnd
? 2005 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 12/13/05 cm1418 preliminary ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. pin descriptions pin name description a1 filter #1 filter #1 input a2 gnd device ground a3 filter #1 filter #1 input b1 filter #2 filter #2 input b2 gnd device ground b3 filter #2 filter #2 input xx 3 2 1 b a orientation marking (see note 2) a3 b3 a2 a1 b2 b1 a1 orientation marking package / pinout diagrams notes: cm1418 csp package top view bottom view (bumps down view) (bumps up view) 2) lead-free devices are s pecified by using a " + " character for the top side orientation mark. 1) these drawings are not to scale. part numbering information pins package standard finish lead-free finish 2 optiguard ? coating ordering part number 1 part marking ordering part number 1 part marking 6 csp y cm1418-02cs cg cm1418-02cp cg 6 csp n cm1418-0bcs al CM1418-0BCP al
? 2005 california micro devices corp. all rights reserved. 12/13/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 cm1418 preliminary specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: these parameters are guarant eed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc current per inductor 30 ma dc package power rating 0.5 w standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operat ing characteristics (see note 1) symbol parameter conditions min typ max units l inductance 3.0 nh r dc channel resistance 0.28 0.35 c tot total channel capacitance 2.5v dc; 1mhz, 30mv ac 187 234 281 pf c 1 capacitance c 1 2.5v dc; 1mhz, 30mv ac 93 117 140 pf v st stand-off voltage i = 10 a6.0v i leak diode leakage current v in = 3.3v 0.1 1.0 a v sig signal clamp voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -9.0 6.8 -6.8 9.0 -5.6 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2 and 3 30 30 kv kv r dyn dynamic resistance positive negative 0.95 0.90 f c cut-off frequency z source = 50 , z load = 50 l = 3nh, c = 117pf 22 mhz
? 2005 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 12/13/05 cm1418 preliminary performance information typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 1. insertion loss vs. frequency (filter #1 to gnd b2) figure 2. insertion loss vs. frequency (filter #2 to gnd b2) to be determined
? 2005 california micro devices corp. all rights reserved. 12/13/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 cm1418 preliminary figure 3. typical diode capacitance vs . input voltage (normalized to 2.5vdc) 0 0.2 0.4 0.6 0.8 1 1.2 -6-5-4-3-2-10123456 voltage capacitance (normalized)
? 2005 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 12/13/05 cm1418 preliminary application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 4. recommended non-solder mask defined pad illustration figure 5. eutectic (snpb) solder ball reflow profile figure 6. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125 - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for eutectic devices using a eutectic solder paste 240c maximum soldering temperature for lead-free devices using a lead-free solder paste 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time ( minutes ) temperature (c)
? 2005 california micro devices corp. all rights reserved. 12/13/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 cm1418 preliminary mechanical details cm1418 csp mechanical specifications the cm1418 is supplied in 6-bump chip scale pack- age (csp). dimensions are presented below. package dimensions for cm1418-0xcs/cp 6-bump chip scale package package dimensions package custom csp bumps 6 dim millimeters inches min nom max min nom max a1 1.175 1.220 1.265 0.0463 0.0480 0.0498 a2 1.675 1.720 1.765 0.0659 0.0677 0.0695 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.310 0.360 0.410 0.0122 0.0142 0.0161 c2 0.310 0.360 0.410 0.0122 0.0142 0.0161 d1 0.562 0.606 0.650 0.0221 0.0239 0.0256 d2 0.356 0.381 0.406 0.0140 0.0150 0.0160 d3 0.575 0.644 0.714 0.0226 0.0254 0.0281 d4 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 1 2 3 b c1 b1 a1 b2 c2 0.30 dia. d1 d2 a2 bottom view side view a 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) 1 2 3 b c1 b1 a1 b2 c2 0.30 dia. note: dimensions in millimeters d3 d4 a2 bottom view side view a 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating non-coated csp optiguard ? coated csp
? 2005 california micro devices corp. all rights reserved. 8 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 12/13/05 cm1418 preliminary mechanical details (cont?d) csp tape and reel specifications figure 7. tape and reel mechanical datatape and reel mechanical data part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel dia. qty per reel p 0 p 1 cm1418-02cs/cp 1.72 x 1.22 x 0.67 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm cm1418-02cs/cp 1.72 x 1.22 x 0.61 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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